Artificial Intelligence Applications and Simulation Tools for High Temperature Materials

Artificial Intelligence Applications and Simulation Tools for High Temperature Materials

Christo Ananth, Akm Samsur Rahman, S. Prabhakar
Pages: 300
DOI: 10.4018/978-1-6684-7750-2
ISBN13: 9781668477502|ISBN10: 1668477505|ISBN13 Softcover: 9781668477519|EISBN13: 9781668477526
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Description & Coverage
Description:

Using high temperature processes is a key tool in real-time manufacturing to manufacture metal products which are very hard for analysis, modeling, and control. The development of artificial intelligence (AI)-aided computer modeling and simulation tools is the key tool for movement of materials in corrosive environments. Advanced control algorithms developed from AI-led computer systems combines computer simulations and topology-driven optimization methods and marches forward to the next phase of furnace design. Developed AI methods based on deep neural networks utilize high-fidelity simulation results to perform real-time critical solutions.

This book provides future projections of AI techniques in high temperature materials, training in machine learning tools, graphical user interface for fast-running AI model of glass-melt furnace operations, setting the furnace temperatures based on complex computation fluid dynamics models, and examples from float-glass, metal casting industries. It opens doors for AI experts to use high temperature materials as an effective tool in real-world problems in high performance computing for energy innovation and high-performance computing for materials. This book is a key reference for students, practitioners, professionals, scientists, engineers, and researchers to improve industry competitiveness and to combat the shortcomings of energy consumption.

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Editor/Author Biographies
Christo Ananth got his B.E. Degree in Electronics and Communication Engineering in 2009 and his M.E. Degree in Applied Electronics in 2013. He received his PhD Degree in Engineering in 2017. He completed his Post Doctoral Research work in Co-operative Networks in 2018. He has almost spent a decade in research, instructing, counseling and down to earth application improvement. His exploration skill covers Image Processing, Co-operative Networks, Electromagnetic Fields, Electronic Devices, Wireless Networks and Medical Electronics. He has taken an interest and presented 3 papers in National level Technical Symposiums, 9 Research papers in National Level Conferences, 31 Research Papers in International level Conferences, 60 Research Papers in refereed and indexed International Journals in the field of Embedded Systems, Networking, Digital Image Processing, Network Security and VLSI. He has 3 International Patents and 5 National Patents to his Credit, out of which, 4 had been granted and 4 had been published. He has attended 45 Technical Seminars/Training Courses/Faculty Development Programs. He has contributed 25 Dissertations / Thesis / Technical Reports in International Publication Houses, 28 International Book Chapters in USA and has authored & published 4 National- level Engineering Text books and authored 3 International-level Engineering text books. He has published 10 Monographs in Reputed International Journals.
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